Ďalšie odvetvie YAMAHA YV100XG

This newly developed fully fixed dual driver technology accelerates acceleration and coordinates

- High speed and high precision multifunctional modular placement machine

- 0.18 seconds/CHIP ultra-high speed placement (best conditions) 16200CPH (grain/hour)

- In IPC9850 condition, the placement speed is up to 16200CPH (equivalent to 0.22 seconds/CHIP)

- 0603 component placement, total precision up to ± 50 microns, full repeatability up to ± 30 microns

- Wide application range, from 0201 (inch) micro components to 31mm QFP components

- Using 2 high resolution multi-vision digital cameras

- Continuous solder ball detection for CSP/BGA components, including determining the defect of solder balls

- YAMAHA's patented flight change nozzle can be selected, which can effectively reduce the idle loss of the machine

- The best choice for universal type

- The Y-axis is driven by high-performance servo amplifiers and high-rigidity threaded rods at the left and right ends.

• maximum board size M-type: 460 x 335 mm
• minimum board size 50 x 50 mm
• maximum board size L-type: 460 x 440 mm
• minimum board size L50 x W50 mm
• Assembly accuracy Absolute accuracy (μ+3σ): ±0.05 mm/chip, ±0.05 mm/QFP
• Assembly speed 0.18 seconds/CHIP 1.7 seconds/QFP,1608/CHIP:16200CPH
• Mountable components 0603-31 mm components, SOP/SOJ/QFP/connectors/PLCC/CSP/BGA
• Dimensions 1650 x 1408 x 1900 mm
• Total weight 1600 kg