YAMAHA YV100XG Pick and place machine ,Chip mounter

This newly developed fully fixed dual driver technology accelerates acceleration and coordinates

↵

- High speed and high precision multifunctional modular placement machine

↵

- 0.18 seconds/CHIP ultra-high speed placement (best conditions) 16200CPH (grain/hour)

↵

- In IPC9850 condition, the placement speed is up to 16200CPH (equivalent to 0.22 seconds/CHIP)

↵

- 0603 component placement, total precision up to ± 50 microns, full repeatability up to ± 30 microns

↵

- Wide application range, from 0201 (inch) micro components to 31mm QFP components

↵

- Using 2 high resolution multi-vision digital cameras

↵

- Continuous solder ball detection for CSP/BGA components, including determining the defect of solder balls

↵

- YAMAHA's patented flight change nozzle can be selected, which can effectively reduce the idle loss of the machine

↵

- The best choice for universal type

↵

- The Y-axis is driven by high-performance servo amplifiers and high-rigidity threaded rods at the left and right ends.

↵

 

↵

↵
• maximum board size M-type: 460 x 335 mm
↵
• minimum board size 50 x 50 mm
↵
• maximum board size L-type: 460 x 440 mm
↵
• minimum board size L50 x W50 mm
↵
• Assembly accuracy Absolute accuracy (μ+3σ): ±0.05 mm/chip, ±0.05 mm/QFP
↵
• Assembly speed 0.18 seconds/CHIP 1.7 seconds/QFP,1608/CHIP:16200CPH
↵
• Mountable components 0603-31 mm components, SOP/SOJ/QFP/connectors/PLCC/CSP/BGA
↵
• Dimensions 1650 x 1408 x 1900 mm
↵
• Total weight 1600 kg
↵

↵weight approx.: 1600 kg↵Approx. Onsite Dimension. (l x w x h): 1650x1408x1900 mm↵